APA
Li E., .Electrical Modeling And Design For 3D System Integration: 3D Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc. : Wiley.
Chicago
Li Er-Ping, .Electrical Modeling And Design For 3D System Integration: 3D Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc. : Wiley.
Harvard
Li E., .Electrical Modeling And Design For 3D System Integration: 3D Integrated Circuits And Packaging, Signal Integrity, Power Integrity And Emc. : Wiley.
MLA
Li Er-Ping, .: Wiley. .